Extreme ultraviolet resist materials for sub-7 nm patterning
Li Li, Xuan Liu, Shyam Chand Pal, Shulan Wang, Christopher Kemper Ober, Emmanuel P. Giannelis
Chemical Society Reviews · 2017 · 인용 346
Continuous ongoing development of dense integrated circuits requires significant advancements in nanoscale patterning technology. As a key process in semiconductor high volume manufacturing (HVM), high resolution lithography is crucial in keeping with Moore's law. Currently, lithography technology for the sub-7 nm node and beyond has been actively investigated approaching atomic level patterning.
EUV technology is now considered to be a potential alternative to HVM for replacing in some cases ArF immersion technology combined with multi-patterning. Development of innovative resist materials will be required to improve advanced fabrication strategies. In this article, advancements in novel resist materials are reviewed to identify design criteria for establishment of a next generation resist platform.
Development strategies and the challenges in next generation resist materials are summarized and discussed.