Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected.

The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system.