Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
J. Jourdon, S. Lhostis, S. Moreau, Jérôme Chossat, M. Arnoux, C. Sart, Y. Henrion, P. Lamontagne, L. Arnaud, N. Bresson, V. Balan, C. Euvrard, Y. Exbrayat, Daniel Scevola, E. Deloffre, Sébastien Mermoz, Andreas Martin, Halim Bilgen, Frederic André, Christine Charles, D. Bouchu, A. Farcy, S. Guillaumet, A. Jouve, H. Frémont, S. Chéramy
2018 · 인용 85
Hybrid bonding is a high-density technology for 3D integration but further interconnect scaling down could jeopardize electrical and reliability performance. A study of the influence of hybrid bonding pitch shrinkage on a 3D stacked backside illuminated CMOS image sensor was performed from a process, device performance and robustness perspectives, from 8.8 μm down to 1.44 μm bonding pitches. As a result no defect related to smaller bonding pads was evidenced neither by thermal cycling nor by electromigration, thus validating fine-pitch hybrid bonding robustness and introduction for next generation image sensors.